Thermal Transport Through 1D Sandwich Structure

Publication Issue: 
Volume 39, Issue 2, 2018
Page No: 
Date Received: 
Sunday, January 28, 2018
Authors' Name: 
Tarika K. Patel
P. N. Gajjar
Authors' Affiliation and Address: 
Department of Physics, University School of Sciences, Gujarat University, Ahmedabad 380 009, Gujarat, India
In present paper we proposed 1D sandwich model to investigate heat transport. Basically, sandwich model consists of three regions in which the middle region is filled with different material than that of two outer regions. We simulated temperature profile, heat flux and thermal conductivity of one dimensional sandwich structure as a function of thickness of filling part of the model. The interface thermal resistance and temperature gradient are also computed. FPU-β potential is used as intermolecular potential. The outer layers of the sandwich structure are kept at constant temperature T_L = 1.1 and T_R = 0.9 using Langevin heat baths. The mass of each oscillators in outer layer is taken as M = 1.0 while that in the filler layer is M_s = 0.5. It is noticed that as the thickness of sandwiched layer increases, the heat flux and hence the thermal conductivity increases. The phonon propagation from left layer to middle layer (from higher mass to lower mass) and again from middle layer to right layer (from lower mass to again higher mass) is found less thermal resistive in the present case. In this case, the distance between two interfaces plays very important role in overall performance of the sandwich model. The model can be used to design good thermal conductor or insulator by varying width of the filler layer.
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